Don Fritz

Title: Don Fritz - Innovator in Semiconductor Packaging

Introduction

Don Fritz is a notable inventor based in San Jose, California. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative designs that enhance package reliability.

Latest Patents

Don Fritz holds a patent for a "Flip chip package with warpage control." This invention provides a semiconductor flip chip package that includes heat spreader lids rigidly attached to the die or packaging substrate. The bond created can withstand the considerable bowing pressures caused by the coefficient of thermal expansion (CTE) mismatch between the die and substrate. As a result, the package experiences less bowing, leading to improved co-planarity with the printed circuit board (PCB) to which it is ultimately bound. This innovation enhances package reliability, especially for large die sizes.

Career Highlights

Don Fritz is associated with Altera Corporation, where he has contributed to advancements in semiconductor technology. His work focuses on improving the performance and reliability of semiconductor packages, which are critical in modern electronic devices.

Collaborations

Some of his coworkers include Wen-chou Vincent Wang and Yuan Hang Li, who have collaborated with him on various projects within the semiconductor industry.

Conclusion

Don Fritz's contributions to semiconductor packaging through his innovative patent demonstrate his commitment to enhancing technology in this field. His work continues to influence the reliability and performance of electronic devices.