Do Woo Lee

Title: Innovations of Do Woo Lee in Transfer Molding Technology

Introduction

Do Woo Lee is a notable inventor based in Cheonan, South Korea. He has made significant contributions to the field of semiconductor device packaging through his innovative designs. His work focuses on improving the efficiency and quality of molding processes.

Latest Patents

Do Woo Lee holds a patent for a "Transfer molding apparatus with a cull-block having protrusion." This invention addresses the issue of defective molding caused by air trapped inside the mold body. The design features a cylindrical protrusion at the center of the cull-block and a circular sunken part along the perimeter of the protrusion. This innovative approach effectively prevents air from remaining behind the front of the fluid molding compound during the molding process. As a result, it promotes the production of semiconductor device packages that are free from molding defects.

Career Highlights

Do Woo Lee is currently employed at Samsung Electronics Co., Ltd., where he continues to develop and refine his inventions. His work has been instrumental in advancing the technology used in semiconductor manufacturing. With a focus on quality and efficiency, he has established himself as a key figure in his field.

Collaborations

Do Woo Lee collaborates with talented colleagues, including Dae Sung Lee and Hyun Woo Park. Together, they work on various projects aimed at enhancing semiconductor packaging technologies.

Conclusion

Do Woo Lee's innovative contributions to transfer molding technology have made a significant impact on the semiconductor industry. His patent for a specialized cull-block design exemplifies his commitment to improving manufacturing processes. Through his work at Samsung Electronics Co., Ltd., he continues to drive advancements in this critical field.