Company Filing History:
Years Active: 1998-1999
Title: Do Bum Shin: Innovator in RF Transmission Technology
Introduction
Do Bum Shin is a notable inventor based in Santa Clarita, CA (US). He has made significant contributions to the field of radio frequency (RF) transmission technology. With a total of 2 patents, his work focuses on enhancing the efficiency and performance of multi-layer circuit structures.
Latest Patents
Do Bum Shin's latest patents include innovative designs that address the challenges in RF transmission lines. One of his patents is titled "Wide frequency band transition between via RF transmission lines." This invention features a multi-layer circuit structure that includes a plurality of substrate layers. It incorporates at least one planar transmission line, which can be a microstrip, stripline, or coplanar line, disposed on the substrate layers. Additionally, a via transmission line is connected to the planar transmission line and extends through the substrate layers. The design ensures that the via transmission lines maintain the same topology as the planar transmission line, facilitating a wide frequency band transition.
Career Highlights
Do Bum Shin is currently employed at Itt Industries, Inc., where he continues to develop cutting-edge technologies in RF transmission. His expertise in multi-layer circuit structures has positioned him as a key player in the industry.
Collaborations
Some of his notable coworkers include Ching-Fai Cho and Helmut Carl Maiershofer. Their collaborative efforts contribute to the innovative environment at Itt Industries, Inc.
Conclusion
Do Bum Shin's contributions to RF transmission technology through his patents and work at Itt Industries, Inc. highlight his role as a significant inventor in the field. His innovative designs continue to push the boundaries of technology and improve communication systems.