Location History:
- Chicago, IL (US) (1976 - 1990)
- Buffalo Grove, IL (US) (1993 - 1994)
Company Filing History:
Years Active: 1976-1994
Title: Innovation and Contributions of Dionisio G Cuisia
Introduction
Dionisio G Cuisia is a prominent inventor based in Chicago, IL, with a remarkable portfolio that includes 20 patents. His work primarily revolves around innovative solutions in aqueous systems, focusing on preventing issues such as scale deposition and corrosion of metals.
Latest Patents
Cuisia's latest patents showcase his expertise in developing compositions and processes for aqueous systems. One significant invention is a formulation that prevents the deposition of scale and sludge, utilizing a combination of additives including polyacrylic acid, hydroxy ethylidene diphosphonic acid, and various copolymers. Additionally, he has devised a method for scavenging oxygen in aqueous systems, aimed at inhibiting corrosion. This innovative method involves an oxygen scavenger that effectively removes dissolved oxygen from the system, thereby enhancing metal longevity.
Career Highlights
Throughout his career, Dionisio G Cuisia has garnered experience at notable companies such as W.R. Grace & Co. and Dearborn Chemical Company Ltd. His contributions to the field have led to significant advancements in chemical processes related to water treatment and corrosion prevention.
Collaborations
Cuisia has collaborated with distinguished colleagues in the industry, including Chih M Hwa and Murrell L Salutsky. These partnerships have fostered a creative environment that has yielded practical solutions to complex problems in aqueous systems.
Conclusion
Dionisio G Cuisia’s body of work significantly impacts the fields of chemistry and engineering. His innovative patents reflect a deep understanding of aqueous systems, positioning him as a leading inventor in addressing critical issues related to scale and corrosion. With a career marked by collaboration and impactful inventions, Cuisia continues to inspire future innovations in his field.