Company Filing History:
Years Active: 2004
Title: Innovations by Inventor Dieter Kantz in Semiconductor Testing
Introduction
Dieter Kantz, an inventive mind from Hennigsdorf, Germany, has made significant contributions to the field of semiconductor technology. With a focus on enhancing the efficiency of testing methods, his innovative approach has led to the development of a noteworthy patent.
Latest Patents
Dieter Kantz holds a patent for a "Test configuration for the functional testing of a semiconductor chip." This configuration describes a method for conducting functional tests on semiconductor chips using a support material. The semiconductor chip is equipped with a self-test unit that generates test information, performing checks on its functionality. A unique feature of this innovation is an energy source that provides electrical energy contactlessly, further connecting with the semiconductor chip to ensure an uninterrupted power supply. This testing configuration allows for contactless functional testing while reducing costs through high parallelism, enabling the simultaneous testing of multiple semiconductor chips.
Career Highlights
Kantz has made substantial strides in his career, currently associated with Infineon Technologies AG, a leader in semiconductor solutions. His expertise and dedication have significantly contributed to advancements in the technology sector.
Collaborations
Throughout his career, Dieter Kantz has worked closely with esteemed colleagues, including Jochen Müller. This collaboration has not only bolstered his innovations but also allowed for the exchange of ideas that foster greater technological advances within the industry.
Conclusion
Dieter Kantz exemplifies the spirit of innovation in the semiconductor field. His patent for a contactless testing configuration highlights his commitment to enhancing testing efficiency and reducing operational costs. With continued dedication to research and development, Kantz's work is poised to influence future advancements in semiconductor testing technology.