Company Filing History:
Years Active: 1989-1993
Title: The Innovations of Dieter Hagmann
Introduction
Dieter Hagmann, an accomplished inventor based in Wildberg, Germany, holds three patents that showcase his significant contributions to the field of materials science. His groundbreaking work has led to advancements in the formation of dielectric layers, crucial for various technological applications.
Latest Patents
Among his latest inventions is a method for forming a thin dielectric layer on a substrate. This technology involves the creation of a dielectric inorganic layer that is no thicker than approximately 20 nanometers. Remarkably, this layer features a defect density of no more than 0.6 defects per square centimeter, as determined by breakdown voltage (BV) measurements. The innovative method includes forming a layer with the desired composition and thickness on the substrate, followed by ion implantation into the substrate through this layer at a dose of at least 10^15 ions per square centimeter, concluded with an annealing process at a temperature exceeding 500°C for a predetermined duration.
Career Highlights
Dieter Hagmann works with the renowned International Business Machines Corporation (IBM), where he continues to push the boundaries of technology with his research and inventions. His work is vital in enhancing the performance and reliability of electronic components.
Collaborations
Throughout his career, Hagmann has collaborated with esteemed colleagues such as Wolfgang Euen and Hans-Jurgen Wildau. These partnerships have fostered an environment of innovation, allowing for shared insights and advancements in their respective fields.
Conclusion
Dieter Hagmann's contributions to the development of dielectric layers exemplify the importance of innovation in technology. His patents not only advance scientific knowledge but also pave the way for practical applications in the industry, reinforcing the critical role of inventors in shaping the future.