HWASEONG-SI, South Korea

Deokseon Choi


Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Deokseon Choi: Innovator in Semiconductor Packaging

Introduction

Deokseon Choi is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the area of packaging. His innovative work has led to the development of advanced semiconductor packages that enhance performance and reliability.

Latest Patents

Deokseon Choi holds 1 patent for a semiconductor package that includes a stacked chip structure. This patent describes a semiconductor package that features a package substrate with an upper surface containing a bonding pad. The design incorporates a lower semiconductor chip positioned on the upper surface of the package substrate. The lower semiconductor chip has a connect edge region with a connection pad and an open edge region that includes a dam structure with dummy bumps. Additionally, a bonding wire connects the bonding pad and the connection pad, while an upper semiconductor chip is placed on the lower semiconductor chip using an inter-chip bonding layer. The entire assembly is surrounded by a molding portion on the package substrate.

Career Highlights

Deokseon Choi is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His work at Samsung has allowed him to be at the forefront of semiconductor innovation. He has played a crucial role in developing technologies that are essential for modern electronic devices.

Collaborations

Throughout his career, Deokseon Choi has collaborated with talented colleagues, including Hyunggyun Noh and Sangwoo Pae. These collaborations have fostered an environment of innovation and creativity, leading to advancements in semiconductor packaging technologies.

Conclusion

Deokseon Choi is a key figure in the semiconductor industry, known for his innovative patent in semiconductor packaging. His contributions at Samsung Electronics Co., Ltd. and collaborations with fellow inventors highlight his commitment to advancing technology. His work continues to impact the field significantly.

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