Company Filing History:
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Years Active: 1993
Title: Dennis T Baird: Innovator in Circuit Assembly Technology
Introduction
Dennis T Baird is a notable inventor based in Kokomo, Indiana. He has made significant contributions to the field of circuit assembly technology, particularly through his innovative patent.
Latest Patents
Baird holds a patent for a circuit assembly encapsulated with polybutadiene urethane. This invention features an acceleration sensor that is packaged in an open can and encapsulated in an elastomeric polybutadiene compound. The encapsulation maintains its mechanical properties over a temperature range of -40°C to 105°C, effectively transmitting acceleration to the sensor with a unity transfer function. The encapsulation material consists of approximately 90 to 100 parts by weight of polyol and about 20 parts by weight of isocyanate, with the polyol containing at least 70% hydroxy-polybutadiene. To enhance adhesion, a foaming agent and/or an epoxy is added to the mixture. Baird's innovative approach has led to advancements in sensor technology.
Career Highlights
Throughout his career, Dennis T Baird has worked with prominent companies such as Delco Electronics Corporation and Hughes Aircraft Company. His experience in these organizations has contributed to his expertise in circuit assembly and sensor technology.
Collaborations
Baird has collaborated with notable coworkers, including Henry M Sanftleben and Ralph D Hermansen. Their combined efforts have fostered innovation in their respective fields.
Conclusion
Dennis T Baird's contributions to circuit assembly technology through his patent demonstrate his innovative spirit and technical expertise. His work continues to influence advancements in sensor technology and encapsulation materials.