Dennis Jay McBride

Title: Dennis Jay McBride: Innovator in Multi-Chip Modules and Modular Architecture

Introduction

Dennis Jay McBride is a notable inventor based in Wake Forest, NC (US). He holds a total of 5 patents that showcase his contributions to technology, particularly in the fields of multi-chip modules and modular architecture for computer networks.

Latest Patents

Among his latest patents is the "Spacer-connector stud for stacked surface laminated multi-chip modules and methods of manufacture." This invention involves a spacer-connector stud made from a stacked array of glass epoxy laminates, each with a copper layer. The design includes thermal contacts suitable for C4 bump technology, allowing for efficient assembly and soldering of multi-chip modules. Another significant patent is for a "Modular architecture for small computer networks." This innovation describes a system where a host processor and multiple client processors are packaged together, connected via a high-speed bus, facilitating efficient data processing in various environments.

Career Highlights

Dennis has worked with prominent companies such as IBM and Omnicluster Technologies Inc. His experience in these organizations has contributed to his expertise in developing advanced technological solutions.

Collaborations

Throughout his career, Dennis has collaborated with notable individuals, including Frederick Hayes Dill and Daniel T Ling. These partnerships have likely enriched his work and led to innovative advancements in his field.

Conclusion

Dennis Jay McBride's contributions to technology through his patents and career experiences highlight his role as an influential inventor. His work continues to impact the fields of multi-chip modules and modular computer architecture.