Location History:
- Luck Township, Polk County, WI (US) (1983)
- City of Luck, WI (US) (1996)
- Luck, WI (US) (1985 - 1997)
Company Filing History:
Years Active: 1983-1997
Title: Innovations of Dennis D Hansen
Introduction
Dennis D Hansen is a notable inventor based in Luck, Wisconsin. He has made significant contributions to the field of microelectronics, holding a total of 7 patents. His work primarily focuses on adhesive technologies that enhance electronic assemblies.
Latest Patents
One of his latest patents is for an electronic assembly that utilizes a semi-crystalline copolymer adhesive. This invention provides a microelectronic assembly where the adhesive composition electrically interconnects circuit patterns on different substrates. The adhesive includes a semi-crystalline copolymer made from polyether and polyamide monomeric units, along with a tackifier and conductive particles. Another notable patent involves a hot-melt adhesive that remains tacky for over five seconds at room temperature. This adhesive can be spread into a thin layer, allowing for bonding without the need for heat or excessive pressure. It crystallizes quickly, making the bond creep-resistant, and can be applied at significantly lower temperatures than previous hot-melt adhesives.
Career Highlights
Dennis D Hansen is associated with the Minnesota Mining and Manufacturing Company, where he has contributed to various innovative projects. His expertise in adhesive technologies has positioned him as a key player in the development of advanced electronic assembly solutions.
Collaborations
Throughout his career, Hansen has collaborated with talented individuals such as Gaddam N Babu and Michael A Kropp. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Dennis D Hansen's contributions to adhesive technologies in microelectronics have made a significant impact in the field. His innovative patents and collaborations highlight his dedication to advancing technology and improving electronic assembly processes.