Company Filing History:
Years Active: 2018
Title: Innovations of Dennis Bennett
Introduction
Dennis Bennett is an accomplished inventor based in Gilbert, AZ (US). He has made significant contributions to the field of electronic assembly, holding a total of 2 patents. His work focuses on innovative methods for managing heat dissipation in electronic devices.
Latest Patents
One of his latest patents is titled "Electronic assembly with thermal channel and method of manufacture thereof." This invention involves the creation of an electronic assembly that features a thermal channel designed to control airflow for effective heat dissipation. The assembly comprises a top board, a bottom board, and a subassembly that includes a rail, an airflow tab, and an interconnect. The subassembly serves to couple the top and bottom boards together. The rail is equipped with an opening that allows air to pass through, while the interconnect is positioned to face the airflow tab, facilitating the transfer of electrical signals between the top and bottom boards and channeling air through the rail's opening.
Another patent under his name is also related to electronic assemblies. It describes a method of manufacturing that includes an airflow bracket with a circular rail and an airflow tab. This bracket electrically couples the circular rail and the airflow tab. The top board is attached to the circular rail, ensuring electrical connectivity, while the bottom board is also attached to the circular rail, forming a thermal channel that directs air through a vent opening of the circular rail.
Career Highlights
Dennis Bennett is currently employed at Sandisk Technologies Inc., where he continues to innovate in the field of electronic assembly. His work has been instrumental in developing technologies that enhance the performance and reliability of electronic devices.
Collaborations
Throughout his career, Dennis has collaborated with notable colleagues, including David Lee Dean and Robert W. Ellis. These partnerships have contributed to the advancement of his projects and the successful implementation of his inventions.
Conclusion
Dennis Bennett's contributions to electronic assembly technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the challenges in heat management within electronic devices, paving the way for future advancements in the field.