Demin Liu

Title: Demin Liu: Innovator in Bonding Technology

Introduction

Demin Liu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of bonding technology, particularly through his innovative patent.

Latest Patents

Demin Liu holds a patent for a bonding element and a method for manufacturing the same. This patent outlines a comprehensive method that includes several steps: providing a carrier substrate, forming a first metal layer on the carrier substrate, and creating a first insulating layer that includes a first through hole. The process continues with the formation of a first passivation layer and a first conductive layer in the first through hole, which together create a first connecting bump. Following this, a first substrate is formed on the first connection bump and the first insulating layer. The carrier substrate and the first metal layer are then removed to create a first sub-bonding element. Finally, the first sub-bonding element is connected to a second sub-bonding element using the surface of the first passivation of the first connection bump to form the bonding element. This innovative approach enhances the efficiency and effectiveness of bonding elements in various applications.

Career Highlights

Demin Liu is affiliated with National Yang Ming Chiao Tung University, where he continues to advance his research and development in bonding technologies. His work has garnered attention for its practical applications and innovative methodologies.

Collaborations

Demin Liu collaborates with esteemed colleagues such as Han-Wen Hu and Yi-Chieh Tsai, contributing to a dynamic research environment that fosters innovation and technological advancement.

Conclusion

Demin Liu's contributions to bonding technology through his patent demonstrate his commitment to innovation and excellence in his field. His work not only enhances existing technologies but also paves the way for future advancements in bonding methods.