Company Filing History:
Years Active: 2014-2015
Title: The Innovations of Deguo Sun
Introduction
Deguo Sun is a prominent inventor based in Tianjin, China. He has made significant contributions to the field of semiconductor technology. With a total of 2 patents to his name, his work has had a notable impact on the industry.
Latest Patents
One of Deguo Sun's latest patents is a semiconductor device package with a cap element. This innovative method of assembling a semiconductor device involves providing a substrate with an array of substrate elements linked by corner elements. Semiconductor dies are positioned on these substrate elements. The assembly includes a cap, frame, and contact structure that supports an array of caps linked to frame corner elements. The design ensures that the caps extend over the corresponding semiconductor dies, allowing for efficient electrical connections. The assembly is then encapsulated and singulated, which involves removing the frame elements to complete the process.
Career Highlights
Deguo Sun is currently employed at Freescale Semiconductor, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His expertise in this area has positioned him as a valuable asset to his company and the industry at large.
Collaborations
Throughout his career, Deguo Sun has collaborated with notable colleagues, including Baoguan Yin and Junhua Luo. These partnerships have fostered innovation and contributed to the advancement of semiconductor technologies.
Conclusion
Deguo Sun's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to shape the future of semiconductor device packaging.