Deborah S Wein

Title: The Innovative Contributions of Deborah S. Wein

Introduction

Deborah S. Wein is a prominent inventor based in Phoenix, AZ (US). She has made significant contributions to the field of microelectronics, holding a total of 4 patents. Her work focuses on developing advanced microelectronic packages that cater to high-frequency devices.

Latest Patents

One of her latest patents is for a high-frequency microelectronics package. This innovative package includes a base that is at least partially conductive and is attached to an RF substrate with a cavity formed at its center. The base can be made of metal or ceramic, with a metal layer deposited on it. The design features a pattern of conductive paths that provide interconnection from the inside to the outside of the package. These conductive patterns are engineered to maintain a constant impedance when uncovered, regardless of the dielectric properties of the covering material. A sealing cap, made from various dielectric materials, is attached to the RF substrate using a non-conductive adhesive, sealing the package once the microelectronic device is mounted inside.

Another notable patent is for a microelectronic package suitable for high-frequency microelectronic devices. Similar to her previous invention, this package also includes a conductive base attached to an RF substrate with a central cavity. It features a pattern of conductive paths for interconnection and utilizes a sealing cap attached by a non-conductive adhesive to secure the microelectronic device within the package.

Career Highlights

Deborah S. Wein is currently associated with Stratedge Corporation, where she continues to innovate in the field of microelectronics. Her expertise and contributions have positioned her as a key figure in her industry.

Collaborations

Throughout her career, Deborah has collaborated with notable colleagues, including Paul M. Anderson and Alan W. Lindner. These collaborations have further enhanced her work and contributions to the field.

Conclusion

Deborah S. Wein's innovative work in microelectronics has led to significant advancements in high-frequency device packaging. Her patents reflect her commitment to excellence and innovation in technology.