San Diego, CA, United States of America

Debbie Forray


Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2010-2011

Loading Chart...
2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Debbie Forray

Introduction

Debbie Forray is a prominent inventor based in San Diego, California. She has made significant contributions to the field of materials science, particularly in the development of advanced mold and underfill compositions. With a total of two patents to her name, Forray's work has had a notable impact on the microelectronic packaging industry.

Latest Patents

Forray's latest patents include "Mold compositions with high adhesion to metal substrates" and "Underfill compositions and methods for use thereof." The first patent is based on the discovery that certain well-defined crosslinkable polyester compounds can enhance adhesion to substrates in mold compositions. This innovation offers improved performance compared to traditional mold compositions that lack these specific compounds. The second patent focuses on the utility of polyester-linked compounds in underfill compositions, which are essential for the microelectronic packaging industry, ensuring reliability and durability in electronic devices.

Career Highlights

Debbie Forray has established herself as a key figure in her field through her innovative research and development efforts. Her work at Designer Molecules, Inc. has allowed her to explore and implement cutting-edge technologies that address industry needs. Forray's expertise in materials science has positioned her as a valuable asset in the advancement of microelectronic packaging solutions.

Collaborations

Forray collaborates with Stephen M Dershem, leveraging their combined expertise to drive innovation in their projects. Their partnership exemplifies the importance of teamwork in achieving groundbreaking advancements in technology.

Conclusion

Debbie Forray's contributions to the field of materials science through her patents and work at Designer Molecules, Inc. highlight her role as an influential inventor. Her innovative approaches to mold and underfill compositions continue to shape the future of the microelectronic packaging industry.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…