Dean Michael Malta

Title: The Innovations of Dean Michael Malta

Introduction

Dean Michael Malta is a notable inventor based in Cary, North Carolina. He holds a total of six patents, showcasing his contributions to the field of electronic packaging and interconnect structures. His work reflects a commitment to advancing technology and improving electronic device functionality.

Latest Patents

One of Dean's latest patents is titled "Three Dimensional Interconnect Structure and Method Thereof." This invention describes a three-dimensional interconnect that includes a first substrate bonded to a second substrate. The first substrate consists of a device layer and a bulk semiconductor layer, with a metal pad on the second substrate. The structure features a via-hole that extends through the device layer, the bulk semiconductor layer, and an electrically insulating layer to the metal pad. Additionally, it includes a dielectric coating on the sidewall of the via-hole and a plasma-treated region of the metal pad. The via metal extends monolithically from the plasma-treated region through the via-hole, electrically interconnecting the device layer to the metal pad.

Another significant patent is "Die Bonding Utilizing a Patterned Adhesion Layer." This invention outlines an electronic package and the method for forming it. The electronic package consists of a first substrate with a first electronic device and through-holes extending through its entire thickness. A second substrate is bonded to the first, with metallizations formed in the through-holes to connect to components of the first electronic device. The method involves forming through-holes, depositing a patternable substance on the second substrate, aligning the substrates, and forming metallizations to connect to the second electronic device.

Career Highlights

Throughout his career, Dean has worked with several prominent companies, including Kobe Steel USA, Inc. and the Research Triangle Institute. His experience in these organizations has contributed to his expertise in electronic packaging and interconnect technologies.

Collaborations

Dean has collaborated with notable individuals in his field, including David L. Dreifus and Brian Rhys Stoner. These collaborations have likely enriched his work and led to innovative solutions in electronic device design.

Conclusion

Dean Michael Malta's contributions to the field of electronics through his patents and career experiences highlight his role as an influential inventor. His innovative approaches to interconnect structures and electronic packaging continue to impact the industry positively.