Company Filing History:
Years Active: 2016-2017
Title: Innovations of De Mei Gong in Power Semiconductor Technology.
Introduction
De Mei Gong is a notable inventor based in Shanghai, China. He has made significant contributions to the field of power semiconductor technology, holding two patents that showcase his innovative approach to device design and manufacturing.
Latest Patents
His latest patents include a power semiconductor package device featuring a locking mechanism and its preparation method. This innovative package device consists of a die paddle, a first pin, a second pin, and a semiconductor chip attached to the die paddle. The design ensures that the first electrode, second electrode, and third electrode of the semiconductor chip are effectively connected to the respective pins and die paddle. A plastic package body encapsulates the semiconductor chip, die paddle, and pins, with the first and second pins strategically located near adjacent corners of the package body. The design incorporates locking mechanisms to prevent the pins from detaching during the manufacturing cutting process, allowing portions of the pins and package body to be trimmed, thereby reducing the overall size of the device.
Career Highlights
De Mei Gong is currently employed at Alpha & Omega Semiconductor Corporation, where he continues to develop cutting-edge semiconductor technologies. His work has been instrumental in advancing the efficiency and reliability of power semiconductor devices.
Collaborations
He collaborates with talented coworkers, including Yan Xun Xue and Hamza Yilmaz, contributing to a dynamic team focused on innovation in semiconductor technology.
Conclusion
De Mei Gong's contributions to power semiconductor technology reflect his commitment to innovation and excellence in the field. His patents not only enhance device performance but also pave the way for future advancements in semiconductor manufacturing.