David W Capson

Title: David W Capson: Innovator in Surface Mount Device Placement Technology

Introduction

David W Capson is a notable inventor based in Hamilton, Canada. He has made significant contributions to the field of electronic assembly through his innovative patent. His work focuses on improving the accuracy and efficiency of surface mount device placement on printed circuit boards.

Latest Patents

David W Capson holds a patent for an "Automatic visual measurement of surface mount device placement." This method inspects the placement and alignment of surface-mounted components during assembly. An infrared camera captures an image of the component leads and corresponding soldering pads in a single exposure. The image is processed by a computer to determine the position and orientation of the leads concerning the soldering pads. This technology allows for the detection of any misalignment, ensuring that defective printed circuit boards can be identified promptly. He has 1 patent to his name.

Career Highlights

David is associated with Canadian Patents & Development Ltd., where he applies his expertise in electronic assembly technologies. His innovative approach has contributed to advancements in the manufacturing process of printed circuit boards.

Collaborations

David collaborates with Randy Tsang, working together to enhance the technology and processes within their field.

Conclusion

David W Capson's contributions to surface mount device placement technology demonstrate his commitment to innovation in electronic assembly. His patent reflects a significant advancement that improves the quality and reliability of printed circuit boards.