Beaverton, OR, United States of America

David P Watson


Average Co-Inventor Count = 6.4

ph-index = 5

Forward Citations = 174(Granted Patents)


Location History:

  • Round Rock, TX (US) (1992)
  • Beaverton, OR (US) (1997 - 2003)

Company Filing History:


Years Active: 1992-2003

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5 patents (USPTO):

Title: The Innovative Contributions of David P. Watson

Introduction

David P. Watson is a notable inventor based in Beaverton, OR (US), recognized for his significant contributions to the field of solder ball connections and assembly processes. With a total of 5 patents to his name, Watson has made strides in enhancing the reliability and efficiency of electronic components.

Latest Patents

Watson's latest patents focus on innovative methods for connecting solder balls to ceramic chip carriers and circuit boards. One of his key inventions involves using high melting temperature Pb/Sn 95/5 solder balls connected to copper pads on ceramic substrates through low melting temperature eutectic Pb/Sn solder. This method employs quick reflow techniques to prevent the dissolution of lead into the eutectic solder, thereby maintaining its melting temperature. The process ensures that the solder balls are centered between the carrier pad and circuit board pad, resulting in more symmetric and reliable joints, especially under high-temperature cycling. Additionally, Watson has developed a method involving two substrates with a planar, mirror-image matrix of metal contacts, where metal balls are positioned between pairs of contacts to enhance alignment and reliability.

Career Highlights

Watson has built a distinguished career at the International Business Machines Corporation (IBM), where he has been instrumental in advancing soldering technologies. His work has not only improved the performance of electronic devices but has also contributed to the overall reliability of electronic assemblies.

Collaborations

Throughout his career, Watson has collaborated with esteemed colleagues, including John Acocella and Donald R. Banks. These partnerships have fostered a creative environment that has led to groundbreaking innovations in the field.

Conclusion

David P. Watson's contributions to solder ball connections and assembly processes exemplify his commitment to innovation in electronics. His patents reflect a deep understanding of materials and processes that enhance the reliability of electronic components. Watson's work continues to influence the industry, paving the way for future advancements.

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