Huntsville, AL, United States of America

David McDonald


 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: **Innovator Spotlight: David McDonald**

Introduction

David McDonald is an accomplished inventor based in Huntsville, Alabama. With a deep commitment to innovation, he has contributed significantly to the field of circuit board technology. His work has not only advanced the understanding of thermal management in electronics but also demonstrated the importance of effective heat transfer systems in printed circuit board assemblies.

Latest Patents

David holds a patent for "Systems for circuit board heat transfer and method of assembling same." This innovative patent introduces a printed circuit board assembly featuring a chassis and a heatframe. The assembly is designed with a thermal interface material (TIM) coupled between the PCB and the heatframe, along with at least one thermal via extending through the PCB and connected to the TIM. This configuration allows efficient heat transfer from the PCB to the chassis, showcasing David's ingenuity in addressing critical challenges in electronic design.

Career Highlights

David is currently employed at General Electric Company, where he applies his expertise in thermal management and circuit board technology. His patent reflects his proactive approach to solving complex engineering problems and highlights his dedication to enhancing electronic systems' performance.

Collaborations

Throughout his career, David has collaborated with talented individuals, including David Shannon Slaton and Jerry L Wright. Such teamwork not only strengthens innovative ideas but also fosters a collaborative environment where diverse perspectives lead to groundbreaking advancements.

Conclusion

David McDonald exemplifies the spirit of innovation with his contributions to circuit board technology. His patented invention addresses a vital aspect of electronic assembly and showcases his commitment to making advancements in the field. As he continues to work with General Electric Company and collaborate with notable colleagues, the future looks bright for further innovations from this talented inventor.

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