Company Filing History:
Years Active: 2004
Title: David John Lewis: Innovator in Semiconductor Packaging
Introduction
David John Lewis is a notable inventor based in Campbell, California. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative patent.
Latest Patents
David holds a patent for a "Solder pad structure for low temperature co-fired ceramic package and method for making the same." This invention provides a package for semiconductor devices, which includes a low temperature co-fired ceramic body featuring multiple conductive interconnect layers. The design incorporates solder ball attach pads that are defined on the solder ball attach side(s) of the ceramic body. Each pad is in contact with a conductive via, ensuring electrical communication with the interconnect layers, and is made with metallic content limited to silver.
Career Highlights
David is currently employed at Zeevo, Inc., where he continues to work on advancements in semiconductor technology. His expertise in low temperature co-fired ceramics has positioned him as a valuable asset in the industry.
Collaborations
David has collaborated with notable colleagues, including Guilian Gao and Stephen Thomas Murphy, contributing to various projects and innovations within the company.
Conclusion
David John Lewis exemplifies innovation in semiconductor packaging through his patented work and collaborations. His contributions continue to influence the field significantly.