David J Lando

Title: The Innovations of David J. Lando

Introduction

David J. Lando is a notable inventor based in Allentown, PA, with a significant contribution to the field of circuit board technology. He holds two patents that showcase his innovative approach to enhancing electronic components. His work has been influential in improving the efficiency and capacity of printed circuit boards and semiconductor packages.

Latest Patents

One of Lando's latest patents is focused on circuit board fabrication leading to increased capacity. This invention involves producing printed circuit boards with multiple circuit layers through a specific processing sequence. The process begins with a copper-clad substrate that is patterned to create the first layer. This patterned metallization is then covered with an energy-sensitive material, which is delineated and developed to reveal portions of the underlying pattern. The substrate undergoes blanket curing to form a rigid layer with strategically placed openings, which are subsequently metallized to create additional copper patterns. This method can be repeated to achieve the desired number of copper layers.

Another significant patent by Lando is for a semiconductor package with high-density I/O lead connections. This invention allows for the coupling of semiconductor bond pads to I/O leads, which is essential when a high density of connections is required. Conductive fingers, supported by insulating tape, are bonded to the ends of the fingers on a lead frame. These tape fingers are electrically connected to the bond pads on one surface of the semiconductor chip through wire bonding. Additionally, the opposite surface of the chip is bonded to a paddle on the lead frame, facilitating maximum heat dissipation.

Career Highlights

Throughout his career, David J. Lando has worked with prominent companies such as American Telephone & Telegraph Co. and AT&T Bell Laboratories. His experience in these organizations has contributed to his expertise in the field of electronics and circuit design.

Collaborations

Lando has collaborated with notable individuals in his field, including Lawrence Arnold Greenberg and Frederick R. Wight, Jr. These collaborations have likely enriched his work and contributed to the development of his innovative patents.

Conclusion

David J. Lando's contributions to circuit board technology and semiconductor packaging demonstrate his commitment to innovation in the electronics industry. His patents reflect a deep understanding of the complexities involved in modern electronic design, making him a significant figure in his field.