Company Filing History:
Years Active: 2010-2016
Title: The Innovative Contributions of David Grey
Introduction
David Grey is a prominent inventor based in Santa Clara, California. He has made significant contributions to the field of semiconductor technology, holding a total of five patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.
Latest Patents
Among his latest patents is the "Multi-die semiconductor package." This invention features a multi-die package that includes a plurality of leads and first and second semiconductor dies that are superimposed and bonded together, forming a die stack. The die stack has opposed first and second sides, with each semiconductor die having gate, drain, and source regions, along with their respective contacts. The design allows for efficient electrical communication between the dies and the leads. Another notable patent is the "Package with multiple dies," which discloses a semiconductor die package that includes a leadframe structure with multiple die attach pads. This innovation enhances the protection and functionality of the semiconductor devices housed within.
Career Highlights
David Grey has worked with notable companies in the semiconductor industry, including Fairchild Semiconductor Corporation and Alpha & Omega Semiconductor Corporation. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.
Collaborations
David has collaborated with talented individuals such as Anup Bhalla and Yi Qiang Su. Their combined efforts have led to advancements in semiconductor packaging and design.
Conclusion
David Grey's contributions to semiconductor technology through his innovative patents and collaborations highlight his significant role in the industry. His work continues to influence the development of efficient semiconductor solutions.