David Garrett

Title: David Garrett: Innovator in Electronics Packaging

Introduction

David Garrett is a notable inventor based in Marietta, GA (US). He has made significant contributions to the field of electronics packaging, particularly through his innovative patents. With a total of 2 patents, Garrett has demonstrated his expertise and commitment to advancing technology in this area.

Latest Patents

Garrett's latest patents include a thermoplastic fluxing underfill composition and method. This invention involves a flip chip that features solder bumps and an underfill that is both thermoplastic and fluxing. The methods for creating such a device simplify the manufacturing processes of flip chips, making them well-suited for a straightforward one-step application to printed circuit boards. Another significant patent is for a hardener for epoxy molding compounds. This invention focuses on novel epoxy molding compounds used for encapsulating microchips in the electronics industry. By incorporating polybenzoxazines as a co-reactant with epoxy resins, the resulting product exhibits reduced moisture adsorption while maintaining a high glass transition temperature.

Career Highlights

Throughout his career, David Garrett has worked with reputable companies, including Cookson Singapore Pte Ltd. and Fry's Metals, Inc. His experience in these organizations has contributed to his development as an inventor and has allowed him to refine his skills in electronics packaging.

Collaborations

Garrett has collaborated with various professionals in his field, including his coworker Mark Wilson. These collaborations have likely enriched his work and led to further innovations in his projects.

Conclusion

David Garrett's contributions to the field of electronics packaging through his patents and career experiences highlight his role as an influential inventor. His work continues to impact the industry positively, paving the way for future advancements.