Company Filing History:
Years Active: 2002-2004
Title: David Feiner: Innovator in Substrate Flattening Technology
Introduction
David Feiner is a notable inventor based in Raanana, Israel. He has made significant contributions to the field of printing technology, particularly in methods and apparatuses that enhance the efficiency and quality of printing processes. With a total of 5 patents to his name, Feiner continues to push the boundaries of innovation in his field.
Latest Patents
Among his latest patents is the "Apparatus for flattening a substrate and method thereof." This invention provides a method and apparatus for flattening a substrate against a surface of a platform. The method involves positioning guides within a platform to ensure that opposite edges of a substrate do not come into contact with at least one print head that is in close proximity over the substrate. Another significant patent is the "Apparatus and method for protecting printing heads." This invention offers a solution for protecting print heads from uncontrolled movement and vibration. The apparatus includes at least one print head, a movable component attachable to a flexible cable carrier, and an isolating component that helps to mitigate the effects of uncontrolled movement and vibration.
Career Highlights
David Feiner is currently associated with Aprion Digital Ltd., where he applies his expertise in developing innovative printing solutions. His work has been instrumental in advancing the capabilities of printing technology, making it more reliable and efficient.
Collaborations
Feiner has collaborated with notable colleagues such as Haggai Karlinski and Rafael Ambar. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
David Feiner's contributions to the field of printing technology through his innovative patents and collaborations highlight his role as a key figure in advancing substrate flattening methods. His work continues to influence the industry and pave the way for future innovations.