Location History:
- Yardley, PA (US) (1976 - 1989)
- St. Louis Park, MN (US) (2004)
Company Filing History:
Years Active: 1976-2004
Title: David E. Carlson: Innovator in Thin-Film Semiconductor Technology
Introduction
David E. Carlson is a prominent inventor based in Yardley, PA, recognized for his significant contributions to the field of semiconductor technology. With an impressive portfolio of 22 patents, he has made substantial advancements, particularly in the fabrication of electrical contacts for thin-film semiconductor devices.
Latest Patents
Among his latest patents is a groundbreaking method for fabricating spaced-apart back contacts on thin films of semiconductor material. This innovative process involves forming strips of buffer material on the semiconductor, which serves as a protective layer during the laser scribing of a metal film. This technique ensures that the underlying semiconductor material remains undamaged while effectively creating a plurality of back contacts. Additionally, this invention has applications in back contacts and multi-cell photovoltaic modules.
Career Highlights
David's career has seen him work with notable companies such as RCA Inc. and Solarex Corporation. His experiences in these organizations have not only enhanced his skills as an inventor but have also allowed him to significantly contribute to the development of cutting-edge technologies in the semiconductor sector.
Collaborations
Throughout his career, David has collaborated with talented individuals, including Brown F. Williams and Christopher R. Wronski. These partnerships have enriched his work and have been instrumental in the success of his innovative projects and patented inventions.
Conclusion
David E. Carlson continues to be a vital figure in the realm of semiconductor innovations. His dedication to improving thin-film technology through inventive methods reflects his commitment to advancing the industry. With a robust portfolio of patents and a history of influential collaborations, Carlson's contributions will undoubtedly continue to shape the future of semiconductor applications.