Company Filing History:
Years Active: 2001
Title: David Bilton: Innovator in Electronic Component Assembly
Introduction
David Bilton is a notable inventor based in Ottawa, Canada. He has made significant contributions to the field of electronic component assembly. His innovative methods have paved the way for advancements in the industry.
Latest Patents
David Bilton holds a patent for a "Method of assembling substrates and electronic components." This method involves assembling a substrate and an electrical or electronic component, where the component has electrically conductive leads made from various alloys. The leads are soldered to copper-based terminals of the substrate using a solder alloy that consists of 99.3% tin and 0.7% copper. This soldering process occurs in a chamber with a nitrogen inert atmosphere, effectively avoiding the use of lead solder.
Career Highlights
David Bilton has worked at Nortel Networks Corporation, where he has applied his expertise in electronic components. His work has been instrumental in enhancing the efficiency and reliability of electronic assemblies.
Collaborations
Some of his notable coworkers include William P. Trumble and Murray W. Hamilton. Their collaboration has contributed to the success of various projects within the company.
Conclusion
David Bilton's innovative methods in electronic component assembly demonstrate his commitment to advancing technology in the field. His contributions continue to influence the industry positively.