Darko Popovic

Title: The Innovations of Darko Popovic

Introduction

Darko Popovic is a notable inventor based in San Diego, California. He has made significant contributions to the field of integrated circuit technology. His innovative work focuses on enhancing connection density in multi-die integrated circuit packages.

Latest Patents

Darko Popovic holds a patent for "Multiple (multi-) die integrated circuit (IC) packages for supporting higher connection density, and related fabrication methods." This patent describes a multi-die IC package that includes split dies provided in respective die packages stacked on top of each other to conserve package area. The design supports signal routing, including through-package signal routing that extends through the die package. Each die package features vertical interconnects adjacent to their respective dies, coupled to a package substrate. This innovative approach eliminates the need for through-silicon-vias (TSVs) that extend through the dies themselves. Additionally, the space created between adjacent interposer substrates of stacked die packages allows for effective heat dissipation.

Career Highlights

Darko Popovic is currently employed at Qualcomm Incorporated, a leading company in the telecommunications and semiconductor industry. His work at Qualcomm has positioned him as a key player in advancing integrated circuit technologies.

Collaborations

Darko has collaborated with talented coworkers such as Durodami Lisk and Yue Li. Their combined expertise contributes to the innovative projects at Qualcomm.

Conclusion

Darko Popovic's contributions to the field of integrated circuits exemplify the spirit of innovation. His patent for multi-die IC packages showcases his commitment to enhancing technology and improving efficiency in electronic devices.