This inventor holds 2 USPTO granted patents. Top assignee: Anadigics, Inc.. Active years: 2002-2003.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2002-2003
Title: Daniel Stofman: Innovator in Wafer Demount Technology
Introduction
Daniel Stofman is a notable inventor based in East Brunswick, NJ (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of wafer demounting. With a total of 2 patents to his name, Stofman's work is recognized for its innovative approach to improving the efficiency of wafer separation processes.
Latest Patents
Stofman's latest patents include a groundbreaking invention titled "Wafer demount receptacle for separation of thinned wafer from mounting carrier." This invention features a substantially circular plate member with an upstanding rim structure designed to facilitate the safe demounting of fragile semiconductor wafers. The stepped rim structure includes two diameters, which helps limit the bending of the wafer during the demounting process. Additionally, the plate member is equipped with a pattern of holes that generates eddy currents in a solvent, effectively softening and dissolving the adhesive that bonds the wafer to its carrier. This innovative receptacle can be used in conjunction with a wafer demount tool that utilizes pressurized gas to enhance the separation process.
Career Highlights
Daniel Stofman is currently employed at Anadigics, Inc., where he continues to develop and refine technologies related to semiconductor manufacturing. His expertise in wafer demounting has positioned him as a key player in advancing the efficiency and reliability of semiconductor production.
Collaborations
Stofman collaborates with various professionals in his field, including his coworker Bhola De. Their combined efforts contribute to the ongoing innovation and development of semiconductor technologies.
Conclusion
Daniel Stofman's contributions to wafer demount technology exemplify his commitment to innovation in the semiconductor industry. His patents reflect a deep understanding of the challenges faced in wafer separation processes and offer practical solutions that enhance manufacturing efficiency.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile