Daniel P Stambaugh

Title: Innovations of Daniel P Stambaugh

Introduction

Daniel P Stambaugh is an accomplished inventor based in Rhinebeck, NY (US). He has made significant contributions to the field of interconnect structures through his innovative patent. His work focuses on enhancing the functionality and reliability of metallization levels in electronic devices.

Latest Patents

Stambaugh holds a patent for "Liner replacements for interconnect openings." This invention involves structures for a liner replacement in an interconnect structure and methods for forming such a replacement. The patent describes a metallization level that includes a conductive feature, with a dielectric layer formed on top. This dielectric layer features an opening that extends vertically to the conductive feature. An adhesion layer is applied to the exposed area of the conductive feature at the base of the opening. Notably, the adhesion layer has a thickness equal to a monolayer or a fraction of a monolayer. Additionally, a barrier layer of a different composition, such as TiN, may be deposited on the adhesion layer before filling the opening with metal through chemical vapor deposition.

Career Highlights

Stambaugh is currently employed at GlobalFoundries Inc., a leading semiconductor manufacturer. His role involves working on advanced technologies that drive innovation in the electronics industry. His expertise in interconnect structures has positioned him as a valuable asset to his team.

Collaborations

Some of his notable coworkers include Yun-Yu Wang and Jeffrey J Brown. Their collaborative efforts contribute to the advancement of technologies within their field.

Conclusion

Daniel P Stambaugh's innovative work in interconnect structures exemplifies the importance of advancements in semiconductor technology. His contributions continue to influence the industry and pave the way for future innovations.