Daniel Mark Boyne

Title: Innovator Spotlight: Daniel Mark Boyne

Introduction

Daniel Mark Boyne, an accomplished inventor based in Austin, TX, has made significant contributions to the field of integrated circuit technology. With a total of four patents to his name, Boyne is known for innovating solutions that enhance the functionality and reliability of electronic devices.

Latest Patents

In Boyne's latest patent, titled "Self-aligned, lateral diffusion barrier in metal lines to eliminate electromigration," he introduces an interconnection wiring structure designed to eliminate electromigration in integrated circuit chips. This innovative structure involves segments of aluminum interspersed with segments of refractory metal, aligned to maintain electrical continuity while optimizing current flow. The design can be further enhanced with underlayers or overlayers made of refractory metal, expanding its applicability to include vias or studs for interconnection lines situated at different levels of the IC chip.

Another notable invention by Boyne is the "Dual channel d.c. low noise measurement system and test methodology." This test system addresses the challenges of measuring 1/f noise in metal interconnects, significantly reducing system noise compared to Johnson noise levels. This advancement allows for quantitative measurements regarding noise contributions due to variations in connection cross-sectional areas and provides qualitative predictions for electromigration lifetimes in metal films, particularly aluminum. The system features multiple nested enclosures, ensuring minimal interference during measurements.

Career Highlights

Daniel Mark Boyne is currently associated with the International Business Machines Corporation (IBM), where he leverages his expertise in electronic design and measurement techniques. His innovative work consistently pushes the boundaries of technology, contributing to IBM's reputation as a leader in the industry.

Collaborations

Throughout his career, Boyne has collaborated with talented professionals, including Glenn A. Biery and Hormazdyar M. Dalal. These collaborations have fostered a dynamic environment where ideas can flourish and lead to groundbreaking innovations.

Conclusion

Daniel Mark Boyne represents the spirit of innovation, continuously striving to improve the technology that underpins modern electronics. His patents not only showcase his technical aptitude but also highlight his commitment to solving real-world problems within the industry. The advancements he has made will undoubtedly continue to influence the future of integrated circuit design and measurement methods.