Daniel Le Bail

Title: The Innovative Contributions of Daniel Le Bail

Introduction

Daniel Le Bail is a notable inventor based in Tourrettes S/Loup, France. He has made significant contributions to the field of electronic component packaging. His innovative methods have the potential to enhance the efficiency and reliability of electronic devices.

Latest Patents

Daniel Le Bail holds a patent for a method for the packaging of electronic components. This method involves mounting at least one electronic component on its active face side to a base. The base includes electrical contacts on an external face and connection pads on a face opposite the external face. It features a first series of via holes connecting the electrical contacts and the connection pads, as well as a second series of holes for aspiration. A deformable film is deposited on the face opposite to the active face of the electronic component. The film is aspirated through the second series of holes to sheath the electronic component. Additionally, the method may include a mineral deposition for hermetic sealing and a conductive deposition for shielding. This innovative approach may find particular application in surface wave filters.

Career Highlights

Daniel Le Bail is associated with Thomson-CSF, a company known for its advancements in technology and electronics. His work there has allowed him to develop and refine his innovative packaging methods.

Collaborations

Throughout his career, Daniel has collaborated with notable colleagues such as Jean-Marc Bureau and Jacques Elziere. These collaborations have likely contributed to the development and success of his innovative ideas.

Conclusion

Daniel Le Bail's contributions to the field of electronic component packaging demonstrate his innovative spirit and dedication to advancing technology. His patent reflects a significant step forward in the efficiency and reliability of electronic devices.