Colombus, OH, United States of America

Daniel G Pikula


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 1988

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1 patent (USPTO):Explore Patents

Title: Daniel G. Pikula: Innovator in Multi-layer Film Structures

Introduction: Daniel G. Pikula is a notable inventor based in Columbus, OH, renowned for his significant contributions to the field of materials science. His innovative spirit has led him to develop a groundbreaking patent that enhances the performance and durability of electrical cables.

Latest Patents: Daniel holds one patent titled "Multi-layer film structure and electrical cable incorporating same." This invention presents a multi-layered adhesive composition particularly suited for adhesion between metallic substrates and vinyl chloride polymer resins. The composition features a unique configuration that includes a metal adherent layer, an intermediate layer, and a vinyl chloride polymer adherent layer, specifically designed for highly plasticized vinyl chloride polymer resins.

Career Highlights: As a key member of the Dow Chemical Company, Daniel has played an essential role in advancing the company's innovative materials portfolio. His work has not only contributed to the field of electrical cable manufacturing but has also paved the way for enhanced product durability and effectiveness in various applications.

Collaborations: Throughout his career, Daniel has collaborated with distinguished colleagues, including Felix Achille and Patricia B. Leng. Their collective expertise and efforts have significantly contributed to their projects, fostering an innovative environment that drives research and development at the Dow Chemical Company.

Conclusion: Daniel G. Pikula’s dedication to innovation and excellence in materials science is evident through his patented work and collaboration with industry professionals. His contributions are a testament to the importance of continued research and development in creating effective solutions for modern technological challenges.

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