Company Filing History:
Years Active: 1999
Title: The Innovations of Daniel D Desorcie
Introduction
Daniel D Desorcie is an accomplished inventor based in St. Albans, Vermont. He has made significant contributions to the field of semiconductor technology, particularly in the area of wafer polishing. His innovative approach has led to the development of a unique apparatus that enhances the polishing process of semiconductor wafers.
Latest Patents
Desorcie holds a patent for a CMP wafer carrier designed for preferential polishing of a wafer. This apparatus includes a wafer carrier with a non-uniform surface structure on its lower surface. This design varies the force applied against the wafer during polishing, resulting in an enhanced polishing effect and a planar surface across the polished wafer. The preferred non-uniform surface structure features a backing film with a central portion of predetermined compressibility and a peripheral portion with a different compressibility. Additionally, the wafer carrier may have a raised circumferential region around its periphery to further optimize the polishing process.
Career Highlights
Desorcie is associated with the International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to explore and develop innovative solutions in semiconductor manufacturing. His patent reflects his commitment to advancing technology in this critical field.
Collaborations
Throughout his career, Desorcie has collaborated with notable colleagues, including Richard John Lebel and Charles A McKinney. These collaborations have contributed to the development of cutting-edge technologies in the semiconductor industry.
Conclusion
Daniel D Desorcie's contributions to semiconductor technology through his innovative patent demonstrate his expertise and commitment to enhancing manufacturing processes. His work continues to influence the industry and pave the way for future advancements.