Davis, CA, United States of America

Dana Wong


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Dana Wong - Innovator in Microencapsulation Technologies

Introduction

Dana Wong is a prominent inventor based in Davis, CA (US). She has made significant contributions to the field of microencapsulation through her innovative patent. Her work focuses on the encapsulation of anionic polymers, which has important applications in various industries.

Latest Patents

Dana Wong holds a patent titled "Encapsulation by cross-linking of anionic polymers by pH induced dissociation of cation-chelate complexes." This patent describes microencapsulation methods that utilize encapsulant, fiber, or film-forming compositions of a cross-linkable anionic polymer, a multivalent cation salt, a chelating agent, and a volatile base. The process involves titrating the generally acidic chelating agent with a volatile base to an elevated pH, enhancing ion-binding capability. The method allows for the formation of a cross-linked matrix through the dissociation of cation-chelate complexes, which is crucial during the spray-drying process.

Career Highlights

Dana Wong has dedicated her career to advancing microencapsulation technologies. Her innovative approach has led to the development of new methods that improve the efficiency and effectiveness of encapsulation processes. She is affiliated with the University of California, where she continues to contribute to research and development in this field.

Collaborations

Dana Wong has collaborated with notable colleagues, including Herbert Benson Scher and Scott Strobel. These partnerships have further enriched her research and have led to advancements in microencapsulation techniques.

Conclusion

Dana Wong is a trailblazer in the field of microencapsulation, with her innovative patent showcasing her expertise and dedication. Her work continues to influence the industry and pave the way for future advancements in encapsulation technologies.

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