Company Filing History:
Years Active: 1992-2002
Title: Dana R Graham: Innovator in Microchip Packaging and RF Technology
Introduction
Dana R Graham is a prominent inventor based in Poway, California. She has made significant contributions to the fields of microchip packaging and RF technology. With a total of 2 patents, her work has advanced the efficiency and reliability of electronic components.
Latest Patents
Dana's latest patents include the "LDMOS transistor heatsink package assembly and manufacturing method." This invention focuses on a heatsink assembly and method of fabrication for high power RF LDMOS transistors, which are essential in mobile telephone basestation pre-antenna amplifiers. The innovative design allows for die attachment to the heatsink flange before bonding the leadframe/spacer to the flange, ensuring a robust connection. Various bonding methods are disclosed that maintain the integrity of the die-to-flange attachment bond. Additionally, her patent includes a unique leadframe/spacer/flange heatsink package that simplifies the attachment process and enhances performance.
Another notable patent is the "Sealing system for hermetic microchip packages." This invention introduces a sealable hermetic microchip package featuring a vent that allows gas to escape during the sealing operation. This design prevents internal pressure buildup, which can lead to defects in the sealing material. The venting mechanism is cleverly integrated into the sealing surface of the lid, ensuring a reliable and hermetic seal.
Career Highlights
Throughout her career, Dana has worked with reputable companies such as Polese Company, Inc. and Cabot Corporation. Her experience in these organizations has contributed to her expertise in the field of microchip technology and RF applications.
Collaborations
Dana has collaborated with notable professionals in her field, including Frank J Polese and Stuart Weinshanker. These partnerships have fostered innovation and the development of cutting-edge technologies.
Conclusion
Dana R Graham is a trailblazer in the realm of microchip packaging and RF technology. Her patents reflect her commitment to advancing electronic component design and functionality. Through her work, she continues to influence the industry and inspire future innovations.