Taicang, China

Dan Li


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2017

Loading Chart...
1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Dan Li

Introduction

Dan Li is a notable inventor based in Taicang, China. He has made significant contributions to the field of electrical engineering, particularly in the development of connectors. His innovative designs have led to the creation of a patented electrical connector that enhances connectivity and functionality.

Latest Patents

Dan Li holds a patent for an "Electrical connector with grounding contact." This connector is designed for electrically connecting with a complementary connector and includes an insulating housing, a number of conductive contacts, and a shielding shell. The insulating housing features a base and a mating tongue that extends forward from the base, with channels that run through both components. Each conductive contact is retained within these channels, featuring a fixing portion, a contacting portion, and a soldering portion. The shielding shell encases the insulating housing and the conductive contacts, with one contact specifically designated for grounding purposes.

Career Highlights

Dan Li is currently employed at Alltop Electronics (Suzhou) Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of electrical connectors, making them more efficient and reliable.

Collaborations

Dan has collaborated with several talented individuals in his field, including Wang-I Yu and Mao-Jung Huang. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Dan Li's contributions to the field of electrical engineering, particularly through his patented innovations, highlight his role as a significant inventor. His work at Alltop Electronics continues to influence the industry and pave the way for future advancements in connectivity solutions.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…