Seoul, South Korea

Daiyong Kim

USPTO Granted Patents = 1 

Average Co-Inventor Count = 20.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: The Innovations of Daiyong Kim

Introduction

Daiyong Kim is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of 3D mesh compression technology. His innovative approach has led to the development of a unique method and apparatus that enhances the efficiency of 3D data processing.

Latest Patents

Daiyong Kim holds a patent for a "Method and apparatus for real-time 3D mesh compression, based on quantization." This invention includes a data analyzing unit that decomposes the data of an input 3D mesh model into vertices information, property information representing the properties of the 3D mesh model, and connectivity information between the vertices. Additionally, the apparatus features a mesh model quantizing unit that produces quantized vertices and property information by utilizing the decomposed data. Furthermore, it includes a decision bit encoding unit that calculates a decision bit using the quantized connectivity information, which is then used to encode the quantized vertex information, property information, and connectivity information.

Career Highlights

Daiyong Kim has worked with prominent organizations such as the Electronics and Telecommunications Research Institute and the Industry-University Cooperation Foundation at Hanyang University. His experience in these institutions has allowed him to refine his skills and contribute to advancements in technology.

Collaborations

Throughout his career, Daiyong Kim has collaborated with esteemed colleagues, including Seung Wook Lee and Bon Ki Koo. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Daiyong Kim's contributions to 3D mesh compression technology exemplify his innovative spirit and dedication to advancing the field. His work continues to influence the way 3D data is processed and utilized in various applications.

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