Shiga, Japan

Daisuke Sakura

USPTO Granted Patents = 1 

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Daisuke Sakura: Innovator in Polyamide Imide Fiber Technology

Introduction

Daisuke Sakura is a prominent inventor based in Shiga, Japan. He has made significant contributions to the field of materials science, particularly in the development of advanced fibers. His innovative work has led to the creation of a unique polyamide imide fiber that showcases remarkable properties.

Latest Patents

Daisuke Sakura holds 1 patent for his invention titled "Polyamide imide fiber, non-woven fabric composed of the fiber, process for manufacture of the non-woven fabric, and separator for electronic component." This invention provides a fiber with a nano-order diameter, produced without dehydration and cyclization through heat treatment after fiber spinning. The fiber exhibits excellent heat resistance and mechanical strength. Additionally, the non-woven fabric made from this fiber has an average diameter ranging from 0.001 μm to 1 μm. The invention also includes a separator for electronic components that boasts high conductivity and reduced thickness, enhancing safety during reflow soldering or short-circuiting.

Career Highlights

Daisuke Sakura is currently employed at Toyo Boseki Kabushiki Kaisha, where he continues to innovate and develop new materials. His work has positioned him as a key figure in the advancement of fiber technology.

Collaborations

Throughout his career, Daisuke has collaborated with notable colleagues, including Masahiko Nakamori and Yasuo Ohta. These partnerships have contributed to the success of his projects and the advancement of their shared goals in materials science.

Conclusion

Daisuke Sakura's contributions to the field of polyamide imide fibers demonstrate his commitment to innovation and excellence. His work not only enhances material properties but also paves the way for advancements in electronic components.

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