Company Filing History:
Years Active: 1992
Title: Daisuke Okaka: Innovator in Semiconductor Technology
Introduction
Daisuke Okaka is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.
Latest Patents
Daisuke Okaka holds a patent for a "Method of fabricating a semiconductor substrate, and semiconductor." This patent discloses a semiconductor device employing a new isolation process. The isolation area is a region where a burying material is embedded in a deep groove formed in a semiconductor body using anisotropic dry etching. Semiconductor elements are created in selected semiconductor regions isolated by this isolation area. The other semiconductor regions, which do not have semiconductor elements, are covered with a thick oxide film produced by the local oxidation of the semiconductor body. This new isolation process is particularly well-suited for bipolar type semiconductor devices, where the deep groove reaches a semiconductor substrate through an N.sup.+ -type buried layer. A thick oxide film formed simultaneously isolates the base region and collector contact region of a bipolar transistor.
Career Highlights
Daisuke Okaka is currently employed at Hitachi, Ltd., where he continues to advance semiconductor technology. His work has been instrumental in developing methods that enhance the performance and reliability of semiconductor devices.
Collaborations
Throughout his career, Daisuke has collaborated with notable colleagues, including Akihisa Uchida and Toshihiko Takakura. These collaborations have contributed to the advancement of innovative solutions in the semiconductor industry.
Conclusion
Daisuke Okaka's contributions to semiconductor technology through his patent and work at Hitachi, Ltd. highlight his role as an influential inventor in the field. His innovative methods continue to shape the future of semiconductor devices.