Dai Ying Wu

Title: The Innovative Contributions of Dai Ying Wu

Introduction

Dai Ying Wu is a notable inventor based in Kirkland, WA (US), recognized for his contributions to computer cooling technologies. With a total of two patents to his name, Wu has made significant strides in enhancing the efficiency and effectiveness of thermal management systems in electronic devices.

Latest Patents

Wu's latest patents include a Modular Computer Cooling System and a Hub-Link Liquid Cooling System. The Modular Computer Cooling System features thermal bridges that passively transfer heat away from various modules of a computer system. This innovative design incorporates a cold plate connected to a cooling dock, which utilizes liquid coolant to dissipate heat effectively. The Hub-Link Liquid Cooling System, on the other hand, employs cooling hubs and heat spreading devices that utilize a two-phase working fluid to absorb and transfer thermal energy. This design allows for greater flexibility in managing space and cooling redundancy within electronic devices.

Career Highlights

Throughout his career, Dai Ying Wu has worked with companies such as Coolanyp, LLC and Wuxi Kalannipu Thermal Management Technology Co., Ltd. His experience in these organizations has contributed to his expertise in thermal management technologies and has facilitated the development of his innovative patents.

Collaborations

Wu has collaborated with notable coworkers, including Peng Cheng and Zhe Wen, who have contributed to his projects and innovations in the field of thermal management.

Conclusion

Dai Ying Wu's contributions to computer cooling technologies through his patents demonstrate his commitment to innovation and efficiency in electronic device design. His work continues to influence the field of thermal management, paving the way for future advancements.