Bryn Athyn, PA, United States of America

D Matthew Odhner


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2023-2024

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2 patents (USPTO):Explore Patents

Title: D Matthew Odhner: Innovator in Wire Bonding Technology

Introduction

D Matthew Odhner is a prominent inventor residing in Bryn Athyn, Pennsylvania. His contributions to the field of engineering, specifically in wire bonding technology, have led to the development of innovative methods that enhance manufacturing processes. With a total of two patents to his name, Odhner plays a critical role in advancing the capabilities of wire bonding machinery.

Latest Patents

Among Odhner's notable patents is a method of operating a wire bonding machine that includes innovative techniques for monitoring the accuracy of bond force during operations. The patent outlines procedures for operating the machine in both automatic and dry cycle modes, ensuring optimal bond force is applied. This technology is vital for manufacturers to achieve precise and reliable bonding, which is essential in the semiconductor industry and other applications requiring high-quality connections.

Career Highlights

D Matthew Odhner is affiliated with Kulicke and Soffa Industries, Inc., a leading company in the field of semiconductor manufacturing equipment. His work at Kulicke and Soffa has focused on improving wire bonding processes, a critical aspect of assembling microelectronic devices. Odhner’s innovative solutions have significantly contributed to advancing the technology that ensures the reliability and performance of electronic components.

Collaborations

Throughout his career, Odhner has collaborated with talented colleagues such as Hui Xu and Wei Qin. These partnerships have fostered an environment of innovation and creativity, allowing for the exchange of ideas and the development of cutting-edge technology in wire bonding applications.

Conclusion

D Matthew Odhner's contributions to wire bonding technology highlight his dedication to innovation and excellence. His patents serve as a testament to his expertise and commitment to advancing the capabilities of manufacturing processes. As the industry continues to evolve, Odhner's work will undoubtedly play a significant role in shaping the future of wire bonding techniques.

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