Corvallis, OR, United States of America

Curt Lee Nelson


Average Co-Inventor Count = 2.5

ph-index = 4

Forward Citations = 92(Granted Patents)


Company Filing History:


Years Active: 2005-2011

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8 patents (USPTO):Explore Patents

Title: Curt Lee Nelson: Innovator in Microelectronic Devices

Introduction

Curt Lee Nelson is a prominent inventor based in Corvallis, OR (US). He has made significant contributions to the field of microelectronics, holding a total of 8 patents. His work focuses on innovative methods and devices that enhance the functionality and efficiency of microelectronic systems.

Latest Patents

One of Nelson's latest patents is titled "Microelectronic device patterned by ablating and subsequently sintering said microelectronic device." This invention involves a microelectronic device that includes a non-polymeric substrate, an organic interlayer, and an indium tin oxide layer. The indium tin oxide layer features an ablated characteristic, which is formed by a laser ablation process prior to sintering. Another notable patent is the "Method of preparing orifice counterbore surface." This method outlines a process for preparing a counterbore surface surrounding an orifice, which includes determining the properties of a fluid to be ejected and controlling the surface characteristics accordingly.

Career Highlights

Curt Lee Nelson is currently employed at Hewlett-Packard Development Company, L.P. His work at this esteemed organization has allowed him to further his research and development in microelectronic technologies. His innovative approaches have contributed to advancements in the industry.

Collaborations

Throughout his career, Nelson has collaborated with notable colleagues, including Michel Macler and Peter S. Nyholm. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Curt Lee Nelson is a distinguished inventor whose work in microelectronics has led to several important patents. His contributions continue to shape the future of technology in this field.

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