Collin M Grove

Title: Collin M Grove: Innovator in Gold Electroplating Adhesion

Introduction

Collin M Grove is a notable inventor based in Eau Claire, WI (US). He has made significant contributions to the field of electroplating, particularly in improving the adhesion of gold to metal surfaces. His innovative approach addresses common challenges faced in the electroplating industry.

Latest Patents

Collin M Grove holds a patent for "Treatment methods and solutions for improving adhesion of gold electroplating on metal surfaces." This patent outlines methods for micro-etching stainless steel surfaces to enhance the adhesion of gold electroplating. The process involves removing organic contamination and chromium oxide, neutralizing iron content, and repassivating the surface with a thin chromium oxide layer before the gold electroplating occurs. This innovative treatment solution is crucial for ensuring high-quality electroplating results.

Career Highlights

Collin is associated with Hutchinson Technology Corporation, where he applies his expertise in electroplating technologies. His work has contributed to advancements in manufacturing processes and product quality within the company.

Collaborations

Collin has collaborated with notable coworkers, including Paul Valentine Pesavento and Douglas P Riemer. Their combined efforts have fostered a productive environment for innovation and development in their field.

Conclusion

Collin M Grove's contributions to the field of gold electroplating adhesion demonstrate his commitment to innovation and excellence. His patent and work at Hutchinson Technology Corporation highlight the importance of advancements in manufacturing technologies.