Company Filing History:
Years Active: 1983-1986
Title: Clois E Powell: Innovator in Adhesive Technologies
Introduction
Clois E Powell is a notable inventor based in Westerville, OH (US), recognized for his contributions to adhesive technologies. He holds a total of 4 patents, showcasing his innovative approach to bonding materials in various applications.
Latest Patents
Among his latest patents is a method for preparing laminated articles, which involves bonding a flexible substrate, such as vinyl, cloth, or paper, to a rigid wood substrate. This method utilizes a curable adhesive composition that consists of an aqueous emulsion of a butyl acrylate-methyl methacrylate-2-hydroxyethyl acrylate terpolymer, adjusted to a pH of 9 to 10 with 2-amino-2-methyl-propanol. This innovative technique is particularly beneficial for creating decorative vinyl/wood laminates used in mobile home construction. Another significant patent involves an improved aqueous latex adhesive composition that combines an aqueous latex with a water-dispersible multi-isocyanate cross-linking agent and a thickener. This composition is designed for room temperature curing and offers enhanced water resistance, making it ideal for structural adhesive applications in lamination manufacturing.
Career Highlights
Clois E Powell has made significant strides in his career, working with Ashland Oil, Inc., where he has applied his expertise in adhesive technologies. His work has contributed to advancements in the manufacturing processes of laminated materials, enhancing their durability and functionality.
Collaborations
Throughout his career, Clois has collaborated with notable coworkers, including Norma J Gruber and Gary L Linden. These partnerships have fostered innovation and development in the field of adhesive technologies.
Conclusion
Clois E Powell's contributions to adhesive technologies through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry, paving the way for advancements in material bonding techniques.