Evansville, IN, United States of America

Clas Nilstoft


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 1997

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1 patent (USPTO):Explore Patents

Title: **Innovative Solutions by Clas Nilstoft**

Introduction

Clas Nilstoft, an accomplished inventor based in Evansville, Indiana, has made significant contributions to packaging technology through his innovative designs. His dedication to creating effective packaging solutions is evident in his patent, demonstrating his ingenuity in the industry.

Latest Patents

Clas Nilstoft holds a patent for a unique "Press-on screw-off self-tapping closure/container package." This innovation features a closure that is pressed onto the neck of the container and can be threaded off with ease. The design incorporates either a helical thread on the container neck or the closure that engages with axial ribs on the opposing part, creating indentations that function as threads or a track for simple unthreading. Notably, this package utilizes a continuous or rotary seal that operates independently of the threaded connection, eliminating the need for a sealing force.

Career Highlights

Nilstoft's career has been marked by his contributions to Rexam Closure Inc., where he has worked diligently to advance packaging solutions. His focused approach to innovation has led to the successful development of practical designs that improve user experience and functionality in the market.

Collaborations

During his tenure, Clas has collaborated with notable colleagues, including Gary V Montgomery and James F Whitehead. These partnerships showcase the importance of teamwork in driving innovation and the development of effective product solutions.

Conclusion

Clas Nilstoft's work exemplifies the spirit of innovation in the packaging industry. His patented designs reflect a deep understanding of functionality and user needs. As he continues his contributions to Rexam Closure Inc., the impact of his inventions is sure to resonate within the field of packaging technology for years to come.

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