Ci-moo Shong

Title: The Innovative Contributions of Ci-moo Shong

Introduction

Ci-moo Shong is a notable inventor based in Sungnam-si, South Korea. He has made significant contributions to the field of microelectromechanical systems (MEMS) through his innovative patent. His work is particularly relevant in the context of advanced packaging processes for MEMS devices.

Latest Patents

Ci-moo Shong holds a patent for a "Metal wiring method for an undercut." This method involves a sophisticated process that includes disposing a MEMS element on a silicon substrate and welding a glass wafer to the upper portion of the silicon substrate. The glass wafer features a hole for connecting metal wiring. The process also includes depositing a thin metal film in the hole and ion-mealing the deposited film. This innovative approach allows for effective connection of metal wiring to a via hole with an undercut, enhancing the functionality of MEMS packaging.

Career Highlights

Ci-moo Shong is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to contribute to cutting-edge technologies and advancements in MEMS packaging.

Collaborations

Throughout his career, Ci-moo Shong has collaborated with talented individuals such as Seok-Jin Kang and Seok-Whan Chung. These collaborations have fostered an environment of innovation and creativity, leading to significant advancements in their respective fields.

Conclusion

Ci-moo Shong's contributions to the field of MEMS packaging through his innovative patent demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and pave the way for future innovations.