Company Filing History:
4 out of 88 
2 out of 19,772 
Years Active: 2001-2002
Title: Innovations of Chung-Yung Sun
Introduction
Chung-Yung Sun is a notable inventor based in Kee-Lung, Taiwan. He has made significant contributions to the field of heat dissipation technology, holding a total of six patents. His work primarily focuses on enhancing the efficiency of electronic packages and integrated circuits.
Latest Patents
One of his latest patents is a heat sink assembly designed for dissipating heat from an electronic package mounted on an electrical socket. This innovative assembly includes a heat sink and a latching member that secures it to the socket. The heat sink features a base plate with multiple upward-projecting fins, creating a receiving channel for the latching member. Additionally, positioning tabs ensure that the assembly remains securely in place on the CPU.
Another significant patent is a heat dissipation device for integrated circuits. This device comprises a heat sink and an assembling device that secures the heat sink to a chip mounted on a printed circuit board. The heat sink is equipped with ears that define apertures, allowing for the integration of a clip, sleeves, and springs to ensure a stable connection to the printed circuit board.
Career Highlights
Chung-Yung Sun has worked with prominent companies in the technology sector, including Foxconn Precision Components Co., Ltd. and Hon Hai Precision Industry Co., Ltd. His experience in these organizations has contributed to his expertise in developing innovative heat dissipation solutions.
Collaborations
He has collaborated with notable coworkers such as Chao-Yang Lee and Wei-Ta Lo, further enhancing his contributions to the field of electronics.
Conclusion
Chung-Yung Sun's innovative patents and career achievements highlight his significant role in advancing heat dissipation technologies. His work continues to impact the efficiency of electronic devices, making him a key figure in the industry.