Chung-Ru Wu

Title: Innovations of Chung-Ru Wu in Chemical Mechanical Polishing

Introduction

Chung-Ru Wu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of chemical mechanical polishing, particularly in the determination of polishing time for target wafers. His innovative approach aims to enhance the efficiency and accuracy of the polishing process, addressing common issues such as under-polishing and over-polishing.

Latest Patents

Chung-Ru Wu holds a patent titled "Method for determining chemical mechanical polishing time." This invention relates to a method that allows for the rapid and accurate determination of polishing time during the chemical mechanical polishing process. The method involves polishing a control wafer to establish a relationship between polishing thickness and time, which is then applied to target wafers to ensure optimal polishing results.

Career Highlights

Chung-Ru Wu is associated with Mosel Vitelic Corporation, where he has been instrumental in advancing technologies related to semiconductor manufacturing. His work focuses on improving the precision of chemical mechanical polishing, which is critical in the production of high-quality semiconductor devices.

Collaborations

Chung-Ru Wu has collaborated with notable colleagues, including Chun-Te Lin and Shan-An Liu. These collaborations have contributed to the development of innovative solutions in the field of semiconductor processing.

Conclusion

Chung-Ru Wu's contributions to the field of chemical mechanical polishing exemplify the importance of innovation in semiconductor manufacturing. His patented method enhances the efficiency of the polishing process, ensuring high-quality outcomes in wafer production.