Chun-Yen Lee

Title: The Innovations of Chun-Yen Lee

Introduction

Chun-Yen Lee is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of intermetallic compounds, particularly in the development of advanced interconnection structures. His work is recognized for its potential applications in various technological domains.

Latest Patents

Chun-Yen Lee holds a patent for a "Dual-phase intermetallic interconnection structure and method of fabricating the same." This innovative patent describes a dual-phase intermetallic interconnection structure that includes a first intermetallic compound, a second intermetallic compound, a first solder layer, and a second solder layer. The second intermetallic compound covers and surrounds the first intermetallic compound. Notably, the first and second intermetallic compounds contain different high-melting point metals. The design also incorporates the first and second solder layers, which are positioned on opposite sides of the second intermetallic compound. This structure is specifically adapted to fill micropore defects generated during the formation of the second intermetallic compound. Chun-Yen Lee has 1 patent to his name.

Career Highlights

Chun-Yen Lee is affiliated with the Industrial Technology Research Institute, where he continues to push the boundaries of innovation in materials science. His work has garnered attention for its practical applications in enhancing the reliability and performance of electronic devices.

Collaborations

Chun-Yen Lee has collaborated with notable colleagues, including Jing-Yao Chang and Tao-Chih Chang. These partnerships have contributed to the advancement of research and development in their respective fields.

Conclusion

Chun-Yen Lee's contributions to the field of intermetallic compounds and his innovative patent highlight his role as a key inventor in Taiwan. His work continues to influence advancements in technology and materials science.